We are grateful to the following sponsors for funding and collaboration:
- Air Force Office of Research (AFOSR)
- Analog Devices, Inc.
- Defense Advanced Research Projects Agency (DARPA)
- Department of Energy (DOE)
- Deshpande Center for Technological Innovation
- Lincoln Laboratory
- National Renewable Energy Laboratory (NREL)
- National Science Foundation (NSF)
- National Science Foundation Industry University Cooperative Research Program (NSF-I/UCR) for Silicon Wafer Engineering and Defect Science Center (SiWEDS)
- National Science Foundation Materials Research Science and Engineering Centers (NSF-MRSEC)
- Nippon Telegraph and Telephone Corporation (NTT Group, Japan)
- Pirelli S.p.A.
- Shin Etsu
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