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2021

Guglielmi, E., Su, P., Zanetto, F., Stoll, K., Serna, S., Ferrari, G., Sampietro, M., Wada, K., Kimerling, L.C. and Agarwal, A., 2021. 1/f Noise Characteristics of Waveguide-Integrated PbTe MIR Detectors and Impact on Limit of Detection. Journal of Lightwave Technology39(22), pp.7326-7333.

Postelnicu, E., Marzen, S., Wen, R., Ma, D., Wang, B., Wada, K., Michel, J. and Kimerling, L., 2021, December. Engineering Low Dark Current Density for Ge-on-Si Photodiodes. In 2021 IEEE 17th International Conference on Group IV Photonics (GFP) (pp. 1-2). IEEE.

Kimerling, L.C., Michel, J., Agarwal, A.M., Wada, K., Weninger, D.M. and Serna, S., Massachusetts Institute Of Technology, 2021. Simultaneous electrical and optical connections for flip chip assembly. U.S. Patent 11,067,754.

Shalaginov, M.Y., An, S., Zhang, Y., Yang, F., Su, P., Liberman, V., Chou, J.B., Roberts, C.M., Kang, M., Rios, C. and Du, Q., 2021. Reconfigurable all-dielectric metalens with diffraction-limited performance. Nature communications12(1), pp.1-8.

Choi, J.W., Sahin, E., Sohn, B.U., Chen, G.F., Ng, D.K., Agarwal, A.M., Kimerling, L.C. and Tan, D.T., 2021. High spectro-temporal compression on a nonlinear CMOS-chip. Light: Science & Applications10(1), pp.1-15.

Su, P., Shalaginov, M., Gu, T., An, S., Li, D., Li, L., Jiang, H., Joo, S., Kimerling, L., Zhang, H. and Hu, J., 2021. Large-area optical metasurface fabrication using nanostencil lithography. Optics Letters46(10), pp.2324-2327.

Singh, R., Nie, Y., Gao, M., Agarwal, A.M. and Anthony, B.W., 2021. Inverse design of photonic meta-structure for beam collimation in on-chip sensing. Scientific Reports11(1), pp.1-11.

Choi, J.W., Sahin, E., Sohn, B.U., Chen, G.F., Ng, D.K., Agarwal, A.M., Kimerling, L.C. and Tan, D.T., 2021, May. 11× temporal compression in an ultra-silicon-rich nitride chip. In 2021 Conference on Lasers and Electro-Optics (CLEO) (pp. 1-2). IEEE.

Lin, Y., Ma, D., Lee, K.H., Wen, R.T., Syaranamual, G., Kimerling, L.C., Tan, C.S. and Michel, J., 2021. PIC-integrable, uniformly tensile-strained Ge-on-insulator photodiodes enabled by recessed SiN x stressor. Photonics Research9(7), pp.1255-1263.

Lin, Y., Son, B., Lee, K.H., Michel, J. and Tan, C.S., 2021. Sub-mA/cm 2 Dark Current Density, Buffer-Less Germanium (Ge) Photodiodes on a 200-mm Ge-on-Insulator Substrate. IEEE Transactions on Electron Devices68(4), pp.1730-1737.

Bao, S., Wang, Y., Lina, K., Zhang, L., Wang, B., Sasangka, W.A., Lee, K.E.K., Chua, S.J., Michel, J., Fitzgerald, E. and Tan, C.S., 2021. A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers. Journal of Semiconductors42(2), p.023106.